Packaging 

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The ability to cut knife-edges on devices allows new packaging approaches.
 
 

A cut knife-edge; two Ti-indiffused waveguides are visible on the surface.	A PM fiber end after cutting.	A  cut knife-edge with photolithographically defined fiducial marks.

  A 3-element Mach-Zehnder modulator array that uses vertically-inserted microstrip lines for rf contact.  
 
 

A packaged 4-element traveling-wave phase modulator array with rf contact assembly removed.	A packaged 4-element traveling-wave phase modulator array with rf contact assembly in place.

 
 

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